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To prohibit purchases of certain semiconductor manufacturing equipment from foreign entities of concern or subsidiaries of foreign entities of concern, and for other purposes.
Summary
This bill prohibits recipients of federal financial assistance for semiconductor manufacturing from purchasing, installing, or using semiconductor manufacturing equipment that is produced or refurbished by foreign entities of concern for 10 years from the date of their agreement with the federal government. The prohibited equipment includes deposition, etching, lithography, inspection, wafer processing, and other semiconductor manufacturing machinery. The Secretary may waive this prohibition if the equipment is unavailable from U.S. or allied countries, if it was only refurbished (not originally manufactured) by a foreign entity of concern, or if national security interests are served. The bill defines the scope of covered equipment and applies these restrictions to federal grant recipients in the semiconductor sector.
AI-generated plain-language summary of the bill text — neutral, and may be imperfect. See the full text below for the exact wording.
Sponsor (1)
- Rep. Lofgren, Zoe [D-CA-18] (D-CA)
10 cosponsors
- Rep. Fedorchak, Julie [R-ND-At Large] (R-ND)
- Rep. Fitzpatrick, Brian K. [R-PA-1] (R-PA)
- Rep. Houchin, Erin [R-IN-9] (R-IN)
- Rep. Krishnamoorthi, Raja [D-IL-8] (D-IL)
- Rep. Landsman, Greg [D-OH-1] (D-OH)
- Rep. Moolenaar, John R. [R-MI-2] (R-MI)
- Rep. Obernolte, Jay [R-CA-23] (R-CA)
- Rep. Peters, Scott H. [D-CA-50] (D-CA)
- Rep. Weber, Randy K. Sr. [R-TX-14] (R-TX)
- Rep. Zinke, Ryan K. [R-MT-1] (R-MT)
Money behind the sponsor
Top reported contributors to Zoe Lofgren’s campaign committee (2024 cycle) — who funds the bill’s sponsor, not a claim about this bill. Data from FEC.
Organizations whose employees gave the most — itemized individual contributions grouped by the donor’s reported employer (FEC Schedule A). Full finance for Zoe Lofgren → · Outside spending →
Actions (2)
- Nov 20, 2025 Referred to the Committee on Energy and Commerce, and in addition to the Committee on Science, Space, and Technology, for a period to be subsequently determined by the Speaker, in each case for consideration of such provisions as fall within the jurisdiction of the committee concerned. · house
- Nov 20, 2025 Introduced in House
Similar bills (6)
Bills with similar text or summary — includes reintroductions across Congresses. Ranked by semantic similarity of the bill text (computed locally); a neutral discovery aid, not a claim the bills are duplicates.
Text versions (1)
Bills are re-published as they move (Introduced → Reported → Engrossed → Enrolled …). Each stage below is a separate text; pick two to see what changed. Data from Congress.gov.
Committee action
What happened to this bill in committee — the meetings where it was considered and every recorded vote taken on it.
Meetings where this bill was on the agenda
Full text
IN THE HOUSE OF REPRESENTATIVES
November 20, 2025
Ms. Lofgren (for herself, Mr. Obernolte, Mr. Krishnamoorthi, Mr. Moolenaar, Mr. Landsman, and Mrs. Houchin) introduced the following bill; which was referred to the Committee on Energy and Commerce, and in addition to the Committee on Science, Space, and Technology, for a period to be subsequently determined by the Speaker, in each case for consideration of such provisions as fall within the jurisdiction of the committee concerned
A BILL
To prohibit purchases of certain semiconductor manufacturing equipment from foreign entities of concern or subsidiaries of foreign entities of concern, and for other purposes.
Be it enacted by the Senate and House of Representatives of the United States of America in Congress assembled,
SECTION 1. SHORT TITLE.
This Act may be cited as the “Chip Equipment Quality, Usefulness, and Integrity Protection Act of 2025” or the “Chip EQUIP Act”.
SEC. 2. PURCHASES OF SEMICONDUCTOR MANUFACTURING EQUIPMENT.
(a) Definitions.—Section 9901 of the William M. (Mac) Thornberry National Defense Authorization Act for Fiscal Year 2021 (15 U.S.C. 4651) is amended by adding at the end the following:
“(14) The term ‘completed, fully assembled’, with respect to semiconductor manufacturing equipment, means the state in which all (or substantially all) necessary parts, chambers, subsystems, and subcomponents have been put together, resulting in such equipment that is—
“(A) ready-to-use or ready-to-install; and
“(B) ready to be purchased directly from an entity.
“(15) The term ‘ineligible semiconductor manufacturing equipment’—
“(A) means completed, fully assembled equipment that is manufactured, assembled, or refurbished by a foreign entity of concern or subsidiary thereof and designed for use in the fabrication, assembly, testing, advanced packaging, production, or research and development of semiconductors;
“(B) includes—
“(i) deposition equipment;
“(ii) etching equipment;
“(iii) lithography equipment;
“(iv) inspection, measuring, and test equipment;
“(v) wafer slicing equipment;
“(vi) wafer dicing equipment;
“(vii) wire bonders;
“(viii) ion implantation equipment;
“(ix) chemical mechanical polishing;
“(x) diffusion or oxidation furnaces;
“(xi) thermal processing equipment; and
“(xii) automated material handling systems; and
“(C) does not include any part, chamber, subsystem, or subcomponent that enables or is incorporated into such equipment.”.
(b) Ineligible Use of Funds.—Section 9909 of the William M. (Mac) Thornberry National Defense Authorization Act for Fiscal Year 2021 (15 U.S.C. 4659) is amended—
(1) by redesignating subsection (f) as subsection (g); and
(2) by inserting after subsection (e) the following new subsection:
“(f) Ineligible Use of Funds.—
“(1) In general.—Subject to paragraph (2), the Secretary shall include in the terms of each agreement with a covered entity for the award of Federal financial assistance under section 9902, or with the recipient of an award made under section 9906, prohibitions with respect to a project relating to the procurement, installation, or use of ineligible semiconductor manufacturing equipment, to be effective for 10 years beginning on the date on which the agreement is signed.
“(2) Waiver.—The Secretary may waive the prohibitions referred to in paragraph (1) if—
“(A) the ineligible semiconductor manufacturing equipment to be purchased by the applicable covered entity is not produced in the United States or an allied or partner country in sufficient and reasonably available quantities or of a satisfactory quality to support established or expected production capabilities;
“(B) the ineligible semiconductor manufacturing equipment at issue was manufactured or assembled by an entity that is not a foreign entity of concern or subsidiary thereof and was refurbished by a foreign entity of concern or subsidiary thereof; or
“(C)(i) the use of the ineligible semiconductor manufacturing equipment complies with the requirements set forth in the Export Administration Regulations (as such term is defined in section 1742 of the Export Control Reform Act of 2018 (50 U.S.C. 4801)); and
“(ii) the Secretary, in consultation with the Director of National Intelligence or the Secretary of Defense, determines such waiver is in the national security interest of the United States.
“(3) Foreign entities of concern.—Nothing in this subsection may be construed to waive the application of section 9907.”. <all>
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